Little Known Facts About Noohapou.
The POU3500 process features dynamic temperature Charge of the process chamber cathode / electrode / anode and will be synchronized with any etch course of action.
thirty% of its peak electrical power intake, presenting our buyers important reduction in functioning costs and greater reliability.
Together with the POU3500, it is possible to reach unparalleled leads to etch functionality, chamber uptime, reduced cost of ownership and fab House utilization – all while improving upon your course of action reliability.
Originally Established in 1985, our enterprise has grown into a identified leader in giving temperature Regulate units to the global semiconductor industry.
This outstanding process, providing a little type component, low price-of-Ownership and Dynamic Temperature Regulate available system and products engineers a whole new Resource to optimize their temperature sensitive processes.
The precision with the POU 3300 allows for impartial Charge of the procedure fluid temperature on the wafer chuck in just +/- 0.one °C of set stage, and also the rapid response time on the system allows for max wafer-to-wafer repeatability all through the etch procedure.
All static TCUs involve excessive cooling & heating capacities due to their pretty substantial method fluid reservoirs. the procedure fuid reservoir on LAUDA-Noah's dynamic temperature control technique is below one gallon.
With our device strategically mounted approximately six feet within the chamber, we reach a way more exact looking through on the chuck temperature. This solution guarantees consistent temperature all over the production large amount, leading to enhanced wafer-to-wafer CD uniformity.
The data more info pertains to the 300mm chamber temperature profile through a high part ratio Etch system, running at incredibly higher RF electric power disorders (~3.8kW). The powerful facets of this knowledge set are:
Dynamic Temperature Handle, as applied in methods like the LAUDA-Noah POU, can be an solution that senses the temperature of the method fluid getting back from the method chamber’s wafer chuck (ESC) and dynamically adjusts the temperature with the equipped procedure fluid based on this serious-time comments.
the info set here is from a 200mm quantity creation wafer fab and clearly illustrates the benefit of the LAUDA-Noah POU method.
The POU3300 method offers dynamic temperature Charge of the method chamber cathode / electrode / anode and might be synchronized with any etch procedure.
The reality is usually that genuine Dynamic Temperature Control can only be accomplished when all 5 (five) of the subsequent procedure style and design and installation requirements are met:
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We need a lot less cooling/heating potential for a similar software as a static TCU as a consequence of our little reservoir volume.